In the Spotlight… Is Airsys’ server-level spray cooling the breakthrough AI data centres need?

In this Sponsored DCR Interview, Jordan O’Brien speaks with Tony Fischels, Vice President of PowerOne, a division of Airsys, about what AI-driven power density is doing to data centre cooling and why the industry may need to rethink how it measures efficiency.

Tony breaks down PowerOne’s two single-phase liquid cooling solution sets (including direct-to-chip) and introduces LiquidRack, a server-level spray cooling approach that delivers coolant directly to the chip (without a cold plate). We also explore how moving pumps and heat exchangers closer to the rack can simplify infrastructure, support legacy data centres with limited space, and help reduce the ‘ancillary equipment’ footprint as rack densities climb.

The conversation also covers why Airsys is promoting Power Compute Effectiveness (PCE) alongside Power Usage Effectiveness (PUE) – and how a ‘thermal evolution path’ could help operators design today while preparing for tomorrow (including potential two-phase solutions).

Watch the full video here.

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