nVent has unveiled its new modular data centre liquid cooling solutions, aligned with chip manufacturers’ current and future cooling requirements.
The new solutions include enhanced coolant distribution unit (CDU) offerings with new row- and rack-based CDUs, alongside advanced technology cooling system (TCS) manifolds. They also include updated racks based on leading reference designs and a new services programme.
nVent showcased the range of solutions alongside its next-generation intelligent power distribution units (PDUs) at SC25, which took place from 16–21 November 2025.
“We are tapping into our deep technical expertise and working collaboratively with chip manufacturers and the broader ecosystem to solve our customers’ unique challenges with these new liquid cooling and power solutions,” said Eric Osborn, General Manager of nVent Data Solutions.
“Our commitment to leading innovation for next-generation AI chips is at the core of the work we have done in this space for more than a decade.”
Leadership in liquid cooling and power
nVent’s new cooling and power portfolio includes modular and scalable row-based CDUs, next-generation PDUs, AC and DC rack CDUs, and new TCS manifolds. Together, these solutions bring cutting-edge cooling infrastructure to data centres to support the AI buildout. nVent’s new CDU and PDU products also include a common control platform that will enhance reliability and improve the user experience for data centre operators.
At the show, the company also highlighted its data centre services offering. Liquid cooling technology brings millions of dollars’ worth of IT equipment into close proximity to liquid, making correct installation and maintenance imperative to avoid costly downtime and repairs. nVent’s comprehensive suite of services, including installation, start-up, preventive maintenance, and spare parts and repairs, helps keep data centre projects on time and running smoothly.
Collaborating with industry leaders
With its deep expertise, including years of experience with global installations and designing for serviceability, nVent is well-positioned to deliver infrastructure solutions that support next-generation reference architectures.
Modern data centres face increasing rack-level power densities, more compute-intensive workloads, and growing demand for modularity to maintain uptime and scalability. nVent and Siemens are combining their expertise to help data centres prepare their cooling and power infrastructure for global deployment and operational resilience. The two companies are collaborating to develop a liquid cooling and power reference architecture, purpose-built for hyperscale AI workloads.
nVent is also participating in Project Deschutes and exhibited its new CDU design based on Google’s specifications at SC25. Project Deschutes 5.0 is a CDU design specification for data centres made available through the Open Compute Project. Project Deschutes is designed to help accelerate the adoption of liquid cooling across the data centre industry.
