ZutaCore has announced a Series C funding round of more than $100 million, as the company looks to scale its waterless, direct-to-chip liquid cooling technology for AI data centres.
The round includes investment from Mitsubishi Electric, Carrier Ventures and Samsung Electronics via Samsung Ventures, alongside additional investors.
The funding will support ZutaCore’s global commercial expansion, as the company looks to meet growing demand from AI and HPC deployments. It will also support further research and development around the thermal requirements of next-generation chip architectures, including in-package thermal management and megawatt-scale deployments.
That focus is becoming increasingly important as AI workloads push data centre power densities higher, forcing operators to rethink how they cool next-generation compute infrastructure. Traditional air cooling is already under pressure in high-density environments, while liquid cooling is increasingly being seen as essential for supporting new AI chips and denser server racks.
ZutaCore claims its waterless two-phase cooling platform can support next-generation AI and HPC processors exceeding 4,000W, enabling higher compute density and sustained performance at scale.
Scaling for global demand
As part of the expansion, ZutaCore has also added four new executives to its leadership team. Yaniv Reinhold has joined as Chief Financial Officer, Sarah Warshavsky Oberman as Chief People Officer, Yoni Nir as Chief Research and Development Officer, and Sharon Shafran as Chief Operating Officer.
They join Erez Freibach, Chairman and CEO, Brian Lillie, President and Chief Revenue Officer, My Truong, Chief Product and Technology Officer, and Susan Mor, Chief of Staff.
The company has also established a 2MW end-of-row emulation platform at its facility in Israel. According to ZutaCore, the platform is designed to replicate real-world thermal and facility interactions without relying on production IT equipment, helping customers validate performance and integration requirements before deployment.
ZutaCore has also continued to develop its OmniTherm cold plate, which enables waterless two-phase cooling for the NVIDIA RTX PRO 6000 Blackwell Server Edition in a single-slot PCIe form factor.
Erez Freibach, Chairman and CEO of ZutaCore, noted, “$100M of funding reflects strong validation from leading global partners and growing demand for our technology. AI is fundamentally reshaping data centre infrastructure, and traditional approaches are no longer sufficient. With our expanding leadership team and continued innovation, we are well positioned to support the next generation of high-performance, sustainable data centres.”
